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| BSS 101 SIPMOS (R) Small-Signal Transistor * N channel * Enhancement mode * Logic Level * VGS(th) = 0.8...2.0V Pin 1 S Type BSS 101 Type BSS 101 BSS 101 Pin 2 G Marking SS 101 Pin 3 D VDS 240 V ID 0.13 A RDS(on) 16 Package TO-92 Ordering Code Q62702-S493 Q62702-S636 Tape and Reel Information E6288 E6325 Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 240 240 Unit V VDS V DGR RGS = 20 k Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current VGS Vgs ID 14 20 A 0.13 TA = 33 C DC drain current, pulsed IDpuls 0.52 TA = 25 C Power dissipation Ptot 0.63 W TA = 25 C Semiconductor Group 1 12/05/1997 BSS 101 Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 200 E 55 / 150 / 56 K/W Unit C Tj Tstg RthJA Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 240 1.4 0.1 2 1 12 15 2 1 60 30 10 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 0.8 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS A nA nA 16 26 VDS = 240 V, VGS = 0 V, Tj = 25 C VDS = 240 V, VGS = 0 V, Tj = 125 C VDS = 130 V, VGS = 0 V, Tj = 25 C Gate-source leakage current IGSS RDS(on) VGS = 20 V, VDS = 0 V Drain-Source on-state resistance VGS = 10 V, ID = 0.13 A VGS = 4.5 V, ID = 0.13 A Semiconductor Group 2 12/05/1997 BSS 101 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 0.06 0.16 60 8 3.5 - S pF 80 12 5 ns 5 8 VDS 2 * ID * RDS(on)max, ID = 0.13 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Rise time tr 8 12 VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Turn-off delay time td(off) 12 16 VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Fall time tf 15 20 VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Semiconductor Group 3 12/05/1997 BSS 101 Electrical Characteristics, at Tj = 25C, unless otherwise specified Symbol Values Parameter min. Reverse Diode Inverse diode continuous forward current IS typ. max. Unit A 0.85 0.13 0.52 V 1.2 TA = 25 C Inverse diode direct current,pulsed ISM - TA = 25 C Inverse diode forward voltage VSD VGS = 0 V, IF = 0.26 A Semiconductor Group 4 12/05/1997 BSS 101 Power dissipation Ptot = (TA) Drain current ID = (TA) parameter: VGS 10 V 0.14 A 0.12 0.70 W 0.60 Ptot 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 ID 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 20 40 60 80 100 120 C 160 20 40 60 80 100 120 C 160 TA TA Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25C Drain-source breakdown voltage V(BR)DSS = (Tj) 285 V 275 V(BR)DSS 270 265 260 255 250 245 240 235 230 225 220 215 -60 -20 20 60 100 C 160 Tj Semiconductor Group 5 12/05/1997 BSS 101 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 0.30 A 0.26 Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C 50 Ptot = 1W k li j hg e f d VGS [V] a 2.0 b c 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0 RDS (on) 40 35 30 25 20 15 a b ID 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 a c d e f g h i j k c ed f h bl j ki g 10 5 VGS [V] = a 2.5 2.0 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0 h i 7.0 8.0 j 9.0 k 10.0 1 2 3 4 5 6 7 8 V 10 0 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 A 0.18 VDS ID Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 s VDS 2 x ID x RDS(on)max 0.32 Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s, VDS2 x ID x RDS(on)max 0.24 S A 0.20 ID 0.24 gfs 0.18 0.16 0.20 0.14 0.16 0.12 0.10 0.12 0.08 0.08 0.06 0.04 0.04 0.02 0.00 0 1 2 3 4 5 6 7 8 V 10 0.00 0.00 0.04 0.08 0.12 0.16 0.20 0.24 A ID 0.30 VGS Semiconductor Group 6 12/05/1997 BSS 101 Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 0.13 A, VGS = 10 V 40 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 32 28 24 20 16 12 VGS(th) 3.6 3.2 2.8 98% 2.4 98% 2.0 typ 1.6 1.2 typ 8 4 0 -60 2% 0.8 0.4 -20 20 60 100 C 160 0.0 -60 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz 10 3 Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s 10 0 pF C 10 2 A IF 10 -1 Ciss 10 1 10 -2 Coss Crss Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 0 0 5 10 15 20 25 30 V VDS 40 10 -3 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 12/05/1997 |
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